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IEC 62047-10:2011 ED1

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials IEC 62047-10:2011 ED1

Publication date:   Jul 26, 2011

General information

60.60 Standard published   Jul 26, 2011

IEC

TC 47/SC 47F

International Standard

31.080.99   Other semiconductor devices

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Scope

IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained. This standard is applicable to metallic, ceramic, and polymeric materials. The contents of the corrigendum of February 2012 have been included in this copy.

Life cycle

NOW

PUBLISHED
IEC 62047-10:2011 ED1
60.60 Standard published
Jul 26, 2011

CORRIGENDA / AMENDMENTS

PUBLISHED
IEC 62047-10:2011/COR1:2012 ED1