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IEC 61191-3:1998 ED1

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

Publication date:   Aug 28, 1998

General information

99.60 Withdrawal effective   May 30, 2017

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IEC

TC 91

International Standard

31.240   Mechanical structures for electronic equipment

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Scope

Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

Life cycle

NOW

WITHDRAWN
IEC 61191-3:1998 ED1
99.60 Withdrawal effective
May 30, 2017

REVISED BY

PUBLISHED
IEC 61191-3:2017 ED2