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IEC 61191-3:2017 ED2

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies IEC 61191-3:2017 ED2

Publication date:   May 30, 2017

General information

60.60 Standard published   May 30, 2017

IEC

TC 91

International Standard

31.240   Mechanical structures for electronic equipment

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Scope

IEC 61191-3:2017 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting).
This edition includes the following significant technical changes with respect to the previous edition:
a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 61191-3:1998 ED1

NOW

PUBLISHED
IEC 61191-3:2017 ED2
60.60 Standard published
May 30, 2017