Revised
Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
WITHDRAWN
IEC 61191-3:1998 ED1
99.60
Withdrawal effective
May 30, 2017
PUBLISHED
IEC 61191-3:2017 ED2