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IEC 61190-1-3:2007/AMD1:2010 ED2

Amendment 1 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Publication date:   Jun 10, 2010

General information

99.60 Withdrawal effective   Dec 13, 2017

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IEC

TC 91

International Standard

31.190   Electronic component assemblies

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PREVIOUSLY

WITHDRAWN
IEC 61190-1-3:2007 ED2

NOW

WITHDRAWN
IEC 61190-1-3:2007/AMD1:2010 ED2
99.60 Withdrawal effective
Dec 13, 2017

REVISED BY

PUBLISHED
IEC 61190-1-3:2017 ED3