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IEC 61190-1-3:2007/AMD1:2010 ED2

Amendment 1 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications IEC 61190-1-3:2007/AMD1:2010 ED2

Publication date:   Jun 10, 2010

General information

99.60 Withdrawal effective   Dec 13, 2017

WPUB   

IEC

TC 91

International Standard

31.190   Electronic component assemblies

Buying

Revised

Language in which you want to receive the document.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 61190-1-3:2007 ED2

NOW

WITHDRAWN
IEC 61190-1-3:2007/AMD1:2010 ED2
99.60 Withdrawal effective
Dec 13, 2017

REVISED BY

PUBLISHED
IEC 61190-1-3:2017 ED3