IEC 61190-1-2:2002 ED1

Name: IEC 61190-1-2:2002 ED1
Brand: IEC
SKU: IEC 61190-1-2:2002 ED1
Price: 139.15 EUR
Availability: InStock
Rating: 5 (84 reviews)

Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly

Publication date: Mar 22, 2002

General information

Current stage: 99.60 Withdrawal effective Apr 26, 2007

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.190 Electronic component assemblies

Buying

Status: Revised

PDF - €139.15

Languages: English French

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Scope

Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).

Life cycle

NOW

WITHDRAWN
IEC 61190-1-2:2002 ED1
99.60 Withdrawal effective
Apr 26, 2007

REVISED BY

WITHDRAWN
IEC 61190-1-2:2007 ED2