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IEC 61190-1-2:2002 ED1

Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly IEC 61190-1-2:2002 ED1

Publication date:   Mar 22, 2002

General information

99.60 Withdrawal effective   Apr 26, 2007

IEC

TC 91

International Standard

31.190   Electronic component assemblies

Buying

Revised

Language in which you want to receive the document.

Scope

Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).

Life cycle

NOW

WITHDRAWN
IEC 61190-1-2:2002 ED1
99.60 Withdrawal effective
Apr 26, 2007

REVISED BY

WITHDRAWN
IEC 61190-1-2:2007 ED2