Revised
Aims at testing and verifying that the markings on semiconductor devices will not become illegible when subject to solvents or cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board assembly process.
This test is applicable for all package types. The test should be considered non-destructive.
The contents of the corrigendum of August 2003 have been included in this copy.
WITHDRAWN
IEC PAS 62175:2000 ED1
WITHDRAWN
IEC 60749:1996 ED2
WITHDRAWN
IEC 60749:1996/AMD1:2000 ED2
WITHDRAWN
IEC 60749:1996/AMD2:2001 ED2
WITHDRAWN
IEC 60749-9:2002 ED1
99.60
Withdrawal effective
Mar 3, 2017
WITHDRAWN
IEC 60749-9:2002/COR1:2003 ED1
PUBLISHED
IEC 60749-9:2017 ED2