IEC 60749-5:2017 provides a steady-state temperature and humidity bias life test for the purpose of evaluating the reliability of non-hermetic packaged solid-state devices in humid environments.
This second edition cancels and replaces the first edition published in 2003. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
a) correction of an error in an equation;
b) inclusion of notes for guidance;
c) clarification of the applicability of test conditions.
WITHDRAWN
IEC 60749-5:2003 ED1
WITHDRAWN
IEC 60749-5:2017 ED2
99.60
Withdrawal effective
Dec 19, 2023
PUBLISHED
IEC 60749-5:2023 ED3