IEC 60749-4:2002/COR1:2003 ED1

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)

General information

99.60 Withdrawal effective   Mar 3, 2017

WPUB   

IEC

TC 47

International Standard

31.080.01   Semiconductor devices in general

Scope

Modification of the validity date: now put at 2007.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60749-4:2002 ED1

NOW

WITHDRAWN
IEC 60749-4:2002/COR1:2003 ED1
99.60 Withdrawal effective
Mar 3, 2017

REVISED BY

PUBLISHED
IEC 60749-4:2017 ED2