IEC 60749-3:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection

Publication date:   Apr 9, 2002

General information

99.60 Withdrawal effective   Mar 3, 2017

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IEC

TC 47

International Standard

31.080.01   Semiconductor devices in general

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Scope

Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types.

The contents of the corrigendum of August 2003 have been included in this copy.

Life cycle

NOW

WITHDRAWN
IEC 60749-3:2002 ED1
99.60 Withdrawal effective
Mar 3, 2017

CORRIGENDA / AMENDMENTS

WITHDRAWN
IEC 60749-3:2002/COR1:2003 ED1

REVISED BY

PUBLISHED
IEC 60749-3:2017 ED2