Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types.
The contents of the corrigendum of August 2003 have been included in this copy.
WITHDRAWN
IEC PAS 62163:2000 ED1
WITHDRAWN
IEC 60749:1996 ED2
WITHDRAWN
IEC 60749:1996/AMD1:2000 ED2
WITHDRAWN
IEC 60749:1996/AMD2:2001 ED2
WITHDRAWN
IEC 60749-3:2002 ED1
99.60
Withdrawal effective
Mar 3, 2017
WITHDRAWN
IEC 60749-3:2002/COR1:2003 ED1
PUBLISHED
IEC 60749-3:2017 ED2