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IEC 60749-22:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength IEC 60749-22:2002 ED1

Publication date:   Sep 12, 2002

General information

99.60   Withdrawal effective   Nov 26, 2025

IEC

TC 47

International Standard

31.080.01   Semiconductor devices in general

Buying

Replaced

Language in which you want to receive the document.

Scope

Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements. The contents of the corrigendum of August 2003 have been included in this copy.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60749:1996 ED2

WITHDRAWN
IEC 60749:1996/AMD1:2000 ED2

WITHDRAWN
IEC 60749:1996/AMD2:2001 ED2

NOW

WITHDRAWN
IEC 60749-22:2002 ED1
99.60 Withdrawal effective
Nov 26, 2025

CORRIGENDA / AMENDMENTS

WITHDRAWN
IEC 60749-22:2002/COR1:2003 ED1

REVISED BY

PUBLISHED
IEC 60749-22-1:2025 ED1

PUBLISHED
IEC 60749-22-2:2025 ED1




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