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IEC 60749-22-1 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - wire bond pull test methods IEC 60749-22-1 ED1

General information

40.00 DIS registered   Oct 25, 2024

CCDV    Dec 13, 2024

IEC

TC 47

International Standard

31.080.01   Semiconductor devices in general

Life cycle

PREVIOUSLY

PUBLISHED
IEC 60749-22:2002 ED1

NOW

IN_DEVELOPMENT
IEC 60749-22-1 ED1
40.00 DIS registered
Oct 25, 2024