IEC 60749-22:2002/COR1:2003 ED1

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

Current stage: 60.60 Standard published Aug 13, 2003

Originator: IEC

Owner: TC 47

Type: International Standard

ICS: 31.080.01 Semiconductor devices in general

PUBLISHED
IEC 60749-22:2002/COR1:2003 ED1
60.60 Standard published
Aug 13, 2003