IEC 60749-22:2002/COR1:2003 ED1

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

Current stage: 99.60 Withdrawal effective Nov 26, 2025

Originator: IEC

Owner: TC 47

Type: International Standard

ICS: 31.080.01 Semiconductor devices in general

WITHDRAWN
IEC 60749-22:2002/COR1:2003 ED1
99.60 Withdrawal effective
Nov 26, 2025