IEC 60749-22-1 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - wire bond pull test methods

Current stage: 40.20 DIS ballot initiated: 12 weeks Dec 13, 2024

Next stage: PRVC Next stage date : Mar 7, 2025

Originator: IEC

Owner: TC 47

Type: International Standard

ICS: 31.080.01 Semiconductor devices in general

IN_DEVELOPMENT
IEC 60749-22-1 ED1
40.20 DIS ballot initiated: 12 weeks
Dec 13, 2024