IEC 60749-22-1 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - wire bond pull test methods

Current stage: 40.00 DIS registered Oct 25, 2024

Next stage: CCDV Next stage date : Dec 13, 2024

Originator: IEC

Owner: TC 47

Type: International Standard

ICS: 31.080.01 Semiconductor devices in general

IN_DEVELOPMENT
IEC 60749-22-1 ED1
40.00 DIS registered
Oct 25, 2024