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IEC 60749-20:2002/COR1:2003 ED1

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

General information

99.60 Withdrawal effective   Dec 9, 2008

IEC

TC 47

International Standard

31.080.01   Semiconductor devices in general

Scope

Modification of the validity date: now put at 2007.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60749-20:2002 ED1

NOW

WITHDRAWN
IEC 60749-20:2002/COR1:2003 ED1
99.60 Withdrawal effective
Dec 9, 2008

REVISED BY

WITHDRAWN
IEC 60749-20:2008 ED2