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IEC 60749-20:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat IEC 60749-20:2002 ED1

Publication date:   Sep 30, 2002

General information

99.60 Withdrawal effective   Dec 9, 2008

IEC

TC 47

International Standard

31.080.01   Semiconductor devices in general

Buying

Revised

Language in which you want to receive the document.

Scope

Applies to semiconductor devices (discrete devices and integrated circuits) - and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices.

The contents of the corrigendum of August 2003 have been included in this copy.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60749:1996 ED2

WITHDRAWN
IEC 60749:1996/AMD1:2000 ED2

WITHDRAWN
IEC 60749:1996/AMD2:2001 ED2

NOW

WITHDRAWN
IEC 60749-20:2002 ED1
99.60 Withdrawal effective
Dec 9, 2008

CORRIGENDA / AMENDMENTS

WITHDRAWN
IEC 60749-20:2002/COR1:2003 ED1

REVISED BY

WITHDRAWN
IEC 60749-20:2008 ED2