Current stage: 60.60 Standard published Jan 17, 2003
Originator: IEC
Owner: TC 47
Type: International Standard
ICS: 31.080.01 Semiconductor devices in general
Status: Published
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Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).
WITHDRAWN IEC PAS 62171:2000 ED1
PUBLISHED IEC 60749-16:2003 ED1 60.60 Standard published Jan 17, 2003