IEC 60749-14:2003 ED1

Name: IEC 60749-14:2003 ED1
Brand: IEC
SKU: IEC 60749-14:2003 ED1
Price: 96.8 EUR
Availability: InStock
Rating: 4 (60 reviews)

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

Publication date: Aug 7, 2003

General information

Current stage: 60.60 Standard published Aug 7, 2003

Originator: IEC

Owner: TC 47

Type: International Standard

ICS: 31.080.01 Semiconductor devices in general

Buying

Status: Published

PDF - €96.80

Languages: English French Spanish

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Scope

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly.
Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC PAS 62184:2000 ED1

WITHDRAWN
IEC 60749:1996 ED2

WITHDRAWN
IEC 60749:1996/AMD1:2000 ED2

WITHDRAWN
IEC 60749:1996/AMD2:2001 ED2

NOW

PUBLISHED
IEC 60749-14:2003 ED1
60.60 Standard published
Aug 7, 2003