IEC 60749-14:2003 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) IEC 60749-14:2003 ED1

Publication date:   Aug 7, 2003

Scope

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly.
Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.