Defines the rapid change of temperature test method and the two-fluid-bath method. This test method may also be used, employing fewer cycles, to test the effect of immersion in heated liquids that are used for the purpose of cleaning devices. This test is applicable to all semiconductor devices. It is considered destructive unless otherwise detailed in the relevant specification. The contents of the corrigenda of January 2003 and August 2003 have been included in this copy.
WITHDRAWN
IEC PAS 62185:2000 ED1
WITHDRAWN
IEC 60749:1996 ED2
WITHDRAWN
IEC 60749:1996/AMD1:2000 ED2
WITHDRAWN
IEC 60749:1996/AMD2:2001 ED2
PUBLISHED
IEC 60749-11:2002 ED1
60.60
Standard published
Apr 12, 2002
PUBLISHED
IEC 60749-11:2002/COR1:2003 ED1
PUBLISHED
IEC 60749-11:2002/COR2:2003 ED1