Describes a shock test intended to determine the suitability of component parts for use in electronic equipment which may be subjected to moderately severe shocks as a result of suddenly applied forces or abrupt changes in motion produced by rough handling, transportation, or field operation. Shock of this type may disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test. It is normally applicable to cavity-type packages.
The contents of the corrigendum of August 2003 have been included in this copy.
WITHDRAWN
IEC PAS 62186:2000 ED1
WITHDRAWN
IEC 60749:1996 ED2
WITHDRAWN
IEC 60749:1996/AMD1:2000 ED2
WITHDRAWN
IEC 60749:1996/AMD2:2001 ED2
WITHDRAWN
IEC 60749-10:2002 ED1
99.60
Withdrawal effective
Apr 27, 2022
WITHDRAWN
IEC 60749-10:2002/COR1:2003 ED1
PUBLISHED
IEC 60749-10:2022 ED2