IEC 60749-10:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock IEC 60749-10:2002 ED1

Publication date:   Apr 9, 2002

General information

99.60 Withdrawal effective   Apr 27, 2022

IEC

TC 47

International Standard

31.080.01   Semiconductor devices in general

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Revised

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Scope

Describes a shock test intended to determine the suitability of component parts for use in electronic equipment which may be subjected to moderately severe shocks as a result of suddenly applied forces or abrupt changes in motion produced by rough handling, transportation, or field operation. Shock of this type may disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test. It is normally applicable to cavity-type packages.

The contents of the corrigendum of August 2003 have been included in this copy.

Life cycle

NOW

WITHDRAWN
IEC 60749-10:2002 ED1
99.60 Withdrawal effective
Apr 27, 2022

CORRIGENDA / AMENDMENTS

WITHDRAWN
IEC 60749-10:2002/COR1:2003 ED1

REVISED BY

PUBLISHED
IEC 60749-10:2022 ED2