Main menu
0
0

IEC 60191-6-5:2001 ED1

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) IEC 60191-6-5:2001 ED1

Publication date:   Aug 27, 2001

General information

60.60 Standard published   Aug 27, 2001

IEC

TC 47/SC 47D

International Standard

31.080.01   Semiconductor devices in general

Buying

Published

Language in which you want to receive the document.

Scope

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array the terminal pitch of which is less than or equal to 0,80 mm.

Life cycle

NOW

PUBLISHED
IEC 60191-6-5:2001 ED1
60.60 Standard published
Aug 27, 2001

REVISED BY

ABANDON
IEC 60191-6-5 ED2