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IEC 60191-6-13:2016 ED2

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

Publication date:   Sep 27, 2016

General information

60.60 Standard published   Sep 27, 2016

IEC

TC 47/SC 47D

International Standard

31.080.01   Semiconductor devices in general

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Scope

IEC 60191-6-13:2016 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in sockets applied to FBGA and FLGA. This edition includes the following significant technical changes with respect to the previous edition:
a) BGA package nominal length and width have been newly expanded to 43 mm and 43 mm, respectively. Accordingly, six socket sizes have been added to the socket group numbers 1, 2 and 3, and twenty-two socket sizes have been added to the socket group number 4.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60191-6-13:2007 ED1

NOW

PUBLISHED
IEC 60191-6-13:2016 ED2
60.60 Standard published
Sep 27, 2016