99.60 Withdrawal effective Sep 27, 2016
IEC
International Standard
31.080.01 Semiconductor devices in general
Revised
IEC 60191-6-13:2007 gives a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array ("FBGA" hereafter) and Fine-pitch Land Grid Array ("FLGA" hereafter). This standard is intended to establish the outline drawings and dimensions of the open-top-type socket out of the test and burn-in sockets applied to FBGA and FLGA.
WITHDRAWN
IEC 60191-6-13:2007 ED1
99.60
Withdrawal effective
Sep 27, 2016
PUBLISHED
IEC 60191-6-13:2016 ED2