IEC 60068-2-69:2017 ED3

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

Publication date:   Jun 19, 2019

General information

60.60 Standard published   Mar 7, 2017

IEC

TC 91

International Standard

19.040   Environmental testing | 31.190   Electronic component assemblies

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Scope

IEC 60068-2-69:2017 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass–fail purposes.
The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads.
This document provides the measurement procedures for solder alloys both with and without lead (Pb).
This edition includes the following significant technical changes with respect to the previous edition:
- integration of IEC 60068-2-54;
- inclusion of tests of printed boards;
- inclusion of new component types, and updating test parameters for the whole component list;
- inclusion of a new gauge R & R test protocol to ensure that the respective wetting balance equipment is correctly calibrated.
The contents of the corrigendum of January 2018 have been included in this copy.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60068-2-54:2006 ED2

WITHDRAWN
IEC 60068-2-69:2007 ED2

NOW

PUBLISHED
IEC 60068-2-69:2017 ED3
60.60 Standard published
Mar 7, 2017

CORRIGENDA / AMENDMENTS

PUBLISHED
IEC 60068-2-69:2017/COR1:2018 ED3

PUBLISHED
IEC 60068-2-69:2017/AMD1:2019 ED3