IEC 60068-2-58:2015 ED4

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Publication date:   Jul 28, 2017

General information

60.60 Standard published   Mar 27, 2015

IEC

TC 91

International Standard

19.040   Environmental testing | 31.190   Electronic component assemblies

Buying

  Published

PDF - €405.35

  English   French  



Buy

Scope

IEC 60068-2-58:2015 outlines test Td, applicable to surface mounting devices (SMD). This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow systems. The solder bath method is applicable to SMDs designed for flow soldering and SMDs designed for reflow soldering when the solder bath (dipping) method is appropriate. The reflow method is applicable to the SMD designed for reflow soldering, to determine the suitability of SMDs for reflow soldering and when the solder bath (dipping) method is not appropriate. This edition includes the following significant technical changes with respect to the previous edition:
- the addition of Sn-Bi low temperature solder alloy;
- the addition of several reflow test conditions in Table 7 - Resistance to soldering heat - Test conditions and severity, reflow method;
- introduction of reflow test method for Test Td3: Dewetting and resistance to dissolution of metallization;
- implementation of guidance for the choice of a test severity in Clause B.3.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60068-2-58:2004 ED3

NOW

PUBLISHED
IEC 60068-2-58:2015 ED4
60.60 Standard published
Mar 27, 2015

CORRIGENDA / AMENDMENTS

PUBLISHED
IEC 60068-2-58:2015/AMD1:2017 ED4