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IEC 60068-2-58:1999 ED2

Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Publication date:   Jan 15, 1999

General information

99.60 Withdrawal effective   Jul 15, 2004

IEC

TC 91

International Standard

19.040   Environmental testing | 31.190   Electronic component assemblies

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  Revised

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Scope

Provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices.

The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow system.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60068-2-58:1989 ED1

NOW

WITHDRAWN
IEC 60068-2-58:1999 ED2
99.60 Withdrawal effective
Jul 15, 2004

REVISED BY

WITHDRAWN
IEC 60068-2-58:2004 ED3