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IEC 60068-2-58:1989 ED1

Environmental testing. Part 2: Tests. Test Td: Solderability, resistance to dissolution of metallization and to soldering heat of Surface Mounting Devices (SMD) IEC 60068-2-58:1989 ED1

Publication date:   Aug 15, 1989

General information

99.60 Withdrawal effective   Jan 15, 1999

IEC

TC 91

International Standard

19.040   Environmental testing | 31.190   Electronic component assemblies

Buying

Revised

Language in which you want to receive the document.

Scope

Determines solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices. The procedure uses a solder bath and applies only to products designed to withstand short-term immersion in molten solder.

Life cycle

NOW

WITHDRAWN
IEC 60068-2-58:1989 ED1
99.60 Withdrawal effective
Jan 15, 1999

REVISED BY

WITHDRAWN
IEC 60068-2-58:1999 ED2