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IEC 60068-2-58:1989 ED1

Environmental testing. Part 2: Tests. Test Td: Solderability, resistance to dissolution of metallization and to soldering heat of Surface Mounting Devices (SMD)

Publication date:   Aug 15, 1989

General information

99.60 Withdrawal effective   Jan 15, 1999

IEC

TC 91

International Standard

19.040   Environmental testing | 31.190   Electronic component assemblies

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  Revised

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Scope

Determines solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices. The procedure uses a solder bath and applies only to products designed to withstand short-term immersion in molten solder.

Life cycle

NOW

WITHDRAWN
IEC 60068-2-58:1989 ED1
99.60 Withdrawal effective
Jan 15, 1999

REVISED BY

WITHDRAWN
IEC 60068-2-58:1999 ED2