EN IEC 61188-6-1:2021

Name: EN IEC 61188-6-1:2021
Brand: CENELEC
SKU: EN IEC 61188-6-1:2021
Price: 50.63 EUR
Availability: InStock
Rating: 4 (60 reviews)

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

Publication date: Aug 16, 2021

General information

Current stage: 60.60 Standard published Apr 2, 2021

Originator: CENELEC

Owner: CLC/SR 91 Electronics assembly technology

Type: European Norm

ICS: 31.180 Printed circuits and boards | 31.190 Electronic component assemblies

Buying

Status: Published

PDF - €50.63

Languages: English

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Scope

IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.

Life cycle

PREVIOUSLY

WITHDRAWN
EN 61188-5-1:2002

NOW

PUBLISHED
EN IEC 61188-6-1:2021
60.60 Standard published
Apr 2, 2021