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EN 61188-5-1:2002

Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements EN 61188-5-1:2002

Publication date:   Sep 25, 2006

General information

99.60 Withdrawal effective   Mar 30, 2024

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards | 31.190   Electronic component assemblies

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Scope

Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.

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WITHDRAWN
EN 61188-5-1:2002
99.60 Withdrawal effective
Mar 30, 2024

REVISED BY

PUBLISHED
EN IEC 61188-6-1:2021