Specifies the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages and peripheral terminal type packages. Tests for durability against mechanical and thermal stress received during or after the mounting process of discrete semiconductor devices and of integrated circuits used mainly for industrial and consumer use equipment.
WITHDRAWN
EN 62137:2004
99.60
Withdrawal effective
Nov 13, 2017
WITHDRAWN
EN 62137:2004/corrigendum Feb. 2005
PUBLISHED
EN 62137-4:2014