0

EN 62137:2004

Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN EN 62137:2004

Publication date:   Aug 10, 2006

General information

99.60 Withdrawal effective   Nov 13, 2017

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.190   Electronic component assemblies

Buying

Withdrawn

Language in which you want to receive the document.

Scope

Specifies the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages and peripheral terminal type packages. Tests for durability against mechanical and thermal stress received during or after the mounting process of discrete semiconductor devices and of integrated circuits used mainly for industrial and consumer use equipment.

Life cycle

NOW

WITHDRAWN
EN 62137:2004
99.60 Withdrawal effective
Nov 13, 2017

CORRIGENDA / AMENDMENTS

WITHDRAWN
EN 62137:2004/corrigendum Feb. 2005

REVISED BY

PUBLISHED
EN 62137-4:2014