IEC 61191-1:2013 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. It also includes recommendations for good manufacturing processes. This edition includes the following significant technical changes with respect to the previous edition: - reference standard IEC 61192-1 has been replaced by IPC-A-610; - some of the terminology has been updated; - references to IEC standards have been corrected; - the use of lead-free alloys in the assembly have been added.
WITHDRAWN
EN 61191-1:1998
WITHDRAWN
EN 61191-1:2013
99.60
Withdrawal effective
Oct 19, 2021
PUBLISHED
EN IEC 61191-1:2018