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EN 61191-1:2013

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies EN 61191-1:2013

Publication date:   Dec 17, 2013

General information

99.60 Withdrawal effective   Oct 19, 2021

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.190   Electronic component assemblies | 31.240   Mechanical structures for electronic equipment

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Scope

IEC 61191-1:2013 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. It also includes recommendations for good manufacturing processes. This edition includes the following significant technical changes with respect to the previous edition: - reference standard IEC 61192-1 has been replaced by IPC-A-610; - some of the terminology has been updated; - references to IEC standards have been corrected; - the use of lead-free alloys in the assembly have been added.

Life cycle

PREVIOUSLY

WITHDRAWN
EN 61191-1:1998

NOW

WITHDRAWN
EN 61191-1:2013
99.60 Withdrawal effective
Oct 19, 2021

REVISED BY

PUBLISHED
EN IEC 61191-1:2018