EN 61188-5-1:2002

Name: EN 61188-5-1:2002
Brand: CENELEC
SKU: EN 61188-5-1:2002
Price: 91.31 EUR
Availability: InStock
Rating: 4 (83 reviews)

Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements

Publication date: Sep 25, 2006

General information

Current stage: 99.60 Withdrawal effective Mar 30, 2024

Originator: CENELEC

Owner: CLC/SR 91 Electronics assembly technology

Type: European Norm

ICS: 31.180 Printed circuits and boards | 31.190 Electronic component assemblies

Buying

Status: Withdrawn

PDF - €91.31

Languages: English

Buy

Scope

Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.

Life cycle

NOW

WITHDRAWN
EN 61188-5-1:2002
99.60 Withdrawal effective
Mar 30, 2024

REVISED BY

PUBLISHED
EN IEC 61188-6-1:2021