EN 60749-30:2005

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing EN 60749-30:2005

Publication date:   Aug 10, 2006

General information

99.60 Withdrawal effective   Sep 21, 2023

CENELEC

CLC/SR 47 Semiconductor devices

European Norm

31.080.01   Semiconductor devices in general

Buying

Withdrawn

Language in which you want to receive the document.

Scope

Establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence described in this standard prior to being submitted to specific in-house reliability testing in order to evaluate long term reliability.

Life cycle

NOW

WITHDRAWN
EN 60749-30:2005
99.60 Withdrawal effective
Sep 21, 2023

CORRIGENDA / AMENDMENTS

WITHDRAWN
EN 60749-30:2005/A1:2011

REVISED BY

PUBLISHED
EN IEC 60749-30:2020