Withdrawn
Establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence described in this standard prior to being submitted to specific in-house reliability testing in order to evaluate long term reliability.
WITHDRAWN
EN 60749-30:2005
99.60
Withdrawal effective
Sep 21, 2023
WITHDRAWN
EN 60749-30:2005/A1:2011
PUBLISHED
EN IEC 60749-30:2020