60.60 Standard published Jun 16, 2017
CENELEC
European Norm
31.080.01 Semiconductor devices in general
IEC 60749-3:2017(E) is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance.
This edition includes the following significant technical changes with respect to the previous edition:
a) reference to the need for ESD protection;
b) inclusion of information on the phenomenon of tin whiskers;
c) inclusion of an optional report form/checklist.
WITHDRAWN
EN 60749-3:2002
PUBLISHED
EN 60749-3:2017
60.60
Standard published
Jun 16, 2017