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EN 60749-3:2002

Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination EN 60749-3:2002

Publication date:   Sep 12, 2003

General information

99.60 Withdrawal effective   Apr 7, 2020

CENELEC

CLC/SR 47 Semiconductor devices

European Norm

31.080.01   Semiconductor devices in general

Buying

Withdrawn

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Scope

Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types.

Life cycle

PREVIOUSLY

WITHDRAWN
EN 60749:1999/A2:2001

WITHDRAWN
EN 60749:1999/A1:2000

WITHDRAWN
EN 60749:1999

NOW

WITHDRAWN
EN 60749-3:2002
99.60 Withdrawal effective
Apr 7, 2020

REVISED BY

PUBLISHED
EN 60749-3:2017