90.93 Standard confirmed Dec 15, 2025
CENELEC
European Norm
31.080.01 Semiconductor devices in general
Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.
PUBLISHED
EN 60749-25:2003
90.93
Standard confirmed
Dec 15, 2025
IN_DEVELOPMENT
prEN IEC 60749-25