EN 60749-20:2009

Name: EN 60749-20:2009
Brand: CENELEC
SKU: EN 60749-20:2009
Price: 12.22 EUR
Availability: InStock
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Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

Publication date: Jul 15, 2010

General information

Current stage: 99.60 Withdrawal effective Oct 5, 2023

Originator: CENELEC

Owner: CLC/SR 47 Semiconductor devices

Type: European Norm

ICS: 31.080.01 Semiconductor devices in general

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Status: Withdrawn

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Languages: English

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Scope

IEC 60749-20:2008 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This second edition cancels and replaces the first edition published in 2002 and constitutes a technical revision. The main changes are as follows: - to reconcile certain classifications of IEC 60749-20 and those of IPC/JEDEC J-STD-020C; - reference IEC 60749-35 instead of Annex A of IEC 60749-20, Edition 1; - update for lead-free solder; - correct certain errors in the original Edition 1.

Life cycle

PREVIOUSLY

WITHDRAWN
EN 60749-20:2003

NOW

WITHDRAWN
EN 60749-20:2009
99.60 Withdrawal effective
Oct 5, 2023

REVISED BY

PUBLISHED
EN IEC 60749-20:2020