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EN 60749-20:2003

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat EN 60749-20:2003

Publication date:   Dec 22, 2003

General information

99.60   Withdrawal effective   Sep 1, 2012

CENELEC

CLC/SR 47 Semiconductor devices

European Norm

31.080.01   Semiconductor devices in general

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Scope

Applies to semiconductor devices (discrete devices and integrated circuits) - and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices.

Life cycle

NOW

WITHDRAWN
EN 60749-20:2003
99.60 Withdrawal effective
Sep 1, 2012

REVISED BY

WITHDRAWN
EN 60749-20:2009




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