EN IEC 60749-20:2020

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat EN IEC 60749-20:2020

Publication date:   Mar 17, 2021

General information

60.60   Standard published   Oct 9, 2020

CENELEC

CLC/TC 47X

European Norm

31.080.01   Semiconductor devices in general

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<!-- NEW! -->IEC 60749-20:2020 is available as <a href="https://webstore.iec.ch/publication/67549">IEC 60749-20:2020 RLV</a> which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.</br></br>IEC 60749-20:2020 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This edition includes the following significant technical changes with respect to the previous edition:

- incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition );

- inclusion of new Clause 3;

- inclusion of explanatory notes.

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EN 60749-20:2009

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PUBLISHED
EN IEC 60749-20:2020
60.60 Standard published
Oct 9, 2020




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