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EN 60749-19:2003

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

Publication date:   Dec 22, 2003

General information

60.60 Standard published   Apr 17, 2003

CENELEC

CLC/TC 47X

European Norm

31.080.01   Semiconductor devices in general

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Scope

Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates generally only applicable to cavity packages or as a process monitor.

Life cycle

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PUBLISHED
EN 60749-19:2003
60.60 Standard published
Apr 17, 2003

CORRIGENDA / AMENDMENTS

PUBLISHED
EN 60749-19:2003/A1:2010

PUBLISHED
EN 60749-19:2003/corrigendum Jun. 2003