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EN 60191-6-12:2002

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type

Publication date:   Nov 20, 2003

General information

99.60 Withdrawal effective   Jul 13, 2014

CENELEC

CLC/SR 47D Mechanical standardization of semiconductor devices

European Norm

31.080.01   Semiconductor devices in general

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Scope

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular.

Life cycle

NOW

WITHDRAWN
EN 60191-6-12:2002
99.60 Withdrawal effective
Jul 13, 2014

REVISED BY

PUBLISHED
EN 60191-6-12:2011