0

EN 60191-6-12:2002

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type EN 60191-6-12:2002

Publication date:   Nov 20, 2003

General information

99.60 Withdrawal effective   Jul 13, 2014

CENELEC

CLC/SR 47D Mechanical standardization of semiconductor devices

European Norm

31.080.01   Semiconductor devices in general

Buying

Withdrawn

Language in which you want to receive the document.

Scope

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular.

Life cycle

NOW

WITHDRAWN
EN 60191-6-12:2002
99.60 Withdrawal effective
Jul 13, 2014

REVISED BY

PUBLISHED
EN 60191-6-12:2011