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Printed board assemblies - Part 10: Application and utilization of protective coatings for electronic assemblies
60.60 Standard published
Corrigendum 1 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
60.60 Standard published
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
60.60 Standard published
Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies
60.60 Standard published
Printed board assemblies - Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units - Best practices
60.60 Standard published
Printed board assemblies - Part 9: Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications - Best practices
60.60 Standard published
Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
60.60 Standard published
Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
60.60 Standard published
Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
60.60 Standard published
Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
60.60 Standard published
Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method
60.60 Standard published
Amendment 1 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
60.60 Standard published
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
60.60 Standard published
Surface mounting technology - Part 5-1: Surface strain on circuit boards - Strain gauge measurement applied to chip components
60.60 Standard published
Product package labels for electronic components using bar code and two-dimensional symbologies
60.60 Standard published
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
60.60 Standard published
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
60.60 Standard published
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
60.60 Standard published
