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Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
60.60 Standard published
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
60.60 Standard published
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
60.60 Standard published
Corrigendum 1 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
60.60 Standard published
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
60.60 Standard published
Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
60.60 Standard published
Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
60.60 Standard published
Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
60.60 Standard published
Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
60.60 Standard published
Amendment 1 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
60.60 Standard published
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
60.60 Standard published
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices ED2
20.99 WD approved for registration as CD
Product package labels for electronic components using bar code and two-dimensional symbologies
60.60 Standard published
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
60.60 Standard published
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
60.60 Standard published
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
60.60 Standard published
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
60.60 Standard published
Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
60.60 Standard published